Offering improved productivity of fully

automatic dual spindle dicing saws by

introducing measures to increase

throughput with proven records in the

field

DFD6341

New standard dual spindle dicing saw

Fully Automatic Dicing Saw

High speed type:

600 mm/sec

Space - saving design

The footprint is reduced by 3% from the DFD6340. Four different

accessories: the transformer, UPS (uninterruptible power supply), CO2

injector, and booster pressure pump can be included internally without

expanding the footprint.

Easy operation

A GUI (graphical user interface) which has been recognized as easy to use

on existing models has been included on the DFD6341. Combined with an

LCD touch panel, the DFD6341 offers stress-free operation for operators.

High speed flash alignment (optional)

High speed flash alignment combines a xenon flash lamp and a high speed

CCD shutter for high speed

Combines a xenon flash lamp and a high-speed CCD shutter to perform high

speed alignment without the need to stop the chuck table, which reduces

alignment time and increases throughput.

Conventional type: 100mm/sec



The DFD6341 is the latest fully automatic dual spindle dicing saw for

ø8-inch wafers. It incorporates the throughput enhancement

technologies pioneered in the DFD6362 for ø300 mm wafers.



A new axis mechanism increases the X-axis feed speed to 1,000

mm/sec. Improved acceleration and deceleration performance for

each axis increases the distance where the axis moves at the

maximum speed for substantially improved throughput.



Optimization of the parts used increases the speed of the major

transport units.



A shorter distance between the spindles allows for less processing

time during dual cut.