Fully Automatic Grinder

DFG8830

DFG8830 Operation flow

positioning table, where centering takes place.

on the spinner.

Specification

Environmental conditions

• Use clean, oil-free air at a dew point of -15 °C or less. (Use a residual oil: 0.1 ppm. Filtration rating:0.01 μm/99.5 % or more).

• Keep room temperature fluctuations within ±1 °C of the set value. (Set value should be between 20 - 25 °C).

• Keep grinding water and cleaning water + 0 - 2 °C above room temperature (fluctuations within 1 °C over one hour).

• Keep spindle cooling water temperature between 20 - 25 °C (fluctuations within 2 °C over an hour).

• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.

• This machine uses water.

• In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.

* All the pressures are described using gauge pressures.

* The above specifications may change due to technical modifications. Please confirm when placing your order.

* For further information please contact your local sales representatives.

Unit

-

φ 4” –φ 6”

-

φ 5” –φ 8”

In-feed grinding with wafer

Rotation

mm

φ 300 Diamond Wheel

Rated Output

kW

6.3

Rated torque range

min

-1

1,000　-　4,000

Thickness variation

within one wafer

3 or less

Thickness variation

between wafers

±3 or less

mm

1,400 × 2,500 × 2,000

kg

Approx.6,000

µm

Specification

Wafer Diameter

Substrate Diameter

Grinding Method

Grinding Wheels

Spindle

Machine weight

Grinding

Accuracy

Machine dimensions(W×D×H)

www.disco.co.jp

2017.12