MPC7445 datasheet(43/64 Pages) FREESCALE

Il numero della parte	MPC7445

Spiegazioni elettronici	RISC Microprocessor Hardware Specifications

PDF	64 Pages

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Produttore elettronici	FREESCALE [Freescale Semiconductor, Inc]

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MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1

Freescale Semiconductor

Package Description

8.3 Substrate Capacitors for the MPC7445, 360 CBGA

Figure 21 shows the connectivity of the substrate capacitor pads for the MPC7445, 360 CBGA. All capacitors are

100 nF.

Figure 21. Substrate Bypass Capacitors for the MPC7445, 360 CBGA

8.4 Package Parameters for the MPC7455, 483 CBGA

The package parameters are as provided in the following list. The package type is 29

× 29 mm, 483-lead ceramic

ball grid array (CBGA).

Package outline

× 29 mm

Interconnects

483 (22

× 22 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height

—

Maximum module height

3.22 mm

Ball diameter

0.89 mm (35 mil)

Capacitor

Pad Number

-1

-2

OVDD

GND

VDD

GND

OVDD

GND

VDD

GND

OVDD

GND

VDD

GND

C3-1

C3-2

C2-2

C1-2

C1-1

C2-1

A1 Corner

C4-1

C4-2

C5-2

C6-2

C6-1

C5-1

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