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INMP411ACEZ-R0 Scheda tecnica(PDF) 12 Page - TDK Electronics |
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INMP411ACEZ-R0 Scheda tecnica(HTML) 12 Page - TDK Electronics |
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12 / 14 page ![]() INMP411 OUTLINE DIMENSIONS Figure 13. 3-Terminal Chip Array Small Outline No-Lead Cavity [LGA_CAV] 4.72 × 3.76 × 1.00 mm Body Dimensions shown in millimeters Figure 14. Package Marking Specification (Top View) 3.86 3.76 3.66 4.82 4.72 4.62 BOTTOM VIEW TOP VIEW SIDE VIEW 0.90 DIA. (PINS 1, 5, 6) 1 3 2 4 5 6 2.62 BSC 3.30 REF 1.10 DIA. 1.68 DIA. 0.25 DIA. (THRU HOLE) 0.79 BSC 2.54 BSC 1.27 BSC 1.10 1.00 0.90 0.24 REF 0.73 REF 1.20 BSC 2.40 BSC 0.68 REF 0.61 REF 0.70 DIA. (PINS 2, 4) 3.14 REF 4.10 REF REFERENCE CORNER PIN 1 YY XXXX 411 LOT TRACEABILITY CODE PIN 1 INDICATION PART NUMBER DATECODE Page 12 of 14 Document Number: DS-INMP411-00 Revision: 1.0. |
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