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MAX16154BECT Scheda tecnica(PDF) 3 Page - Maxim Integrated Products |
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MAX16154BECT Scheda tecnica(HTML) 3 Page - Maxim Integrated Products |
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3 / 20 page ![]() Absolute Maximum Ratings VCC to GND.............................................................. -0.3V to +6V WDI, WD_EN to GND................................... -0.3V to VCC + 0.3V WDO, RST to GND................................................... -0.3V to +6V Maximum Current, Any Pin (input/output) ........................... 20mA Continuous Power Dissipation (WLP) (TA = +70°C, derate 10.5 mW/°C above +70°C) ....................................................... 840mW Continuous Power Dissipation (SOT23) (TA = +70°C, derate 8.70mW/°C above +70°C) ................................................696mW Operating Temperature Range ...........................-40°C to +125°C Junction Temperature ....................................................... +150°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 6 WLP Package Code U6+1 Outline Number 21-0058 Land Pattern Number 90-0175 Thermal Resistance, Four-Layer Board: Junction-to-Ambient (θJA) 115 Junction-to-Case Thermal Resistance (θJC) 80 6 SOT23 Package Code W60C1+2 Outline Number 21-100258 Land Pattern Number — Thermal Resistance, Four-Layer Board: Junction-to-Case Thermal Resistance (θJC) 95 For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/ thermal-tutorial. MAX16152/MAX16153/ MAX16154/MAX16155 nanoPower Supervisor and Watchdog Timer www.maximintegrated.com Maxim Integrated | 3 |
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