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GD5F1GQ4UFFFG Scheda tecnica(PDF) 44 Page - GigaDevice Semiconductor (Beijing) Inc.

Il numero della parte GD5F1GQ4UFFFG
Spiegazioni elettronici  SPI(x1/x2/x4) NAND Flash
PDF  50 Pages
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Produttore elettronici  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
Homepage  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD5F1GQ4UFFFG Scheda tecnica(HTML) 44 Page - GigaDevice Semiconductor (Beijing) Inc.

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SPI(x1/x2/x4) NAND Flash
1G
44
22 PACKAGE INFORMATION
D
E
Top View
D2
E2
L
b
e
Bottom View
c
A1
A
Side View
Figure22-1. WSON8 (8*6mm)
Dimensions
Symbol
A
A1
c
b
D
D2
E
E2
e
L
Unit
mm
Min
0.70
0.00
0.180
0.35
7.90
3.30
5.90
4.20
1.27
0.45
Nom
0.75
0.02
0.203
0.40
8.00
3.40
6.00
4.30
0.50
Max
0.80
0.05
0.250
0.45
8.10
3.50
6.05
4.40
0.55
Inch
Min
0.028
0
0.007
0.014
0.311
0.130
0.232
0.165
0.05
0.018
Nom
0.030
0.001
0.008
0.016
0.315
0.134
0.236
0.169
0.020
Max
0.032
0.002
0.010
0.018
0.319
0.138
0.238
0.173
0.022
Note:
1. Both the package length and width do not include the mold flash.
2. The exposed metal pad area on the bottom of the package is floating.
3. Coplanarity ≤0.08mm. Package edge tolerance≤0.10mm.
4. The lead shape may be of little difference according to different package lead frames. These lead
shapes are compatible with each other.



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