GD5F1GQ4UFFFS datasheet(57/59 Pages) GIGADEVICE

57 / 59 page

SPI(x1/x2/x4) NAND Flash

23 REVISION HISTORY

Version No

Description

Date

Page

AGE

1. Initial Release

2. Add RESET function description with ch13.2

3. Add RESET# pin on Connection Diagram ch3.2

4. Update read ID/UID/CID/parameter page on ch10.

2017-06-14

1.1

Add parameter page CRC value

2017-07-14

1.2

Modify Package WSON8 (6*8mm)

2017-07-20

1.3

Modify the Number of Figure and Table

Modify Package ‘R’ description

Reduce the size of parameter page device model table

Modify Read CID command sequence description

Add automatically read first page of fist block to cache after

RESET (FFH)

2017-09-01

1.4

Add the Note article 4 of Page Program

2017-10-23

1.5

Add the chapter of Valid Part Numbers

2017-11-03

1.6

Add the description of 1Gb SLC NAND Flash

Add the description of Reliability

Delete Valid Part Number of GD5F1GQ4UF9IG

Modify the Figure of Program Load Sequence Diagram typo

Modify the package of LGA8

2017-12-11

1.7

Modify the package of WSON8,SOP16 300mil,TFBGA24

Modify the typo of LGA8

Dec.27.2017

1.8

Add LGA8 package description for hardware reset section

2018-1-16

1.9

Modify some typo

Add Temperature Range J:Industrial(-40

℃ to 105℃) and related

description

Change Memory Mapping CA from<12:0> to <11:0>

Add byte1 and byte2 for two Device ID in Read Sequence Diagram

Add page size 2048bytes + 64bytes with ECC enabled

Modify

figures11-1,11-2,11-4,11-5,11-6

from

Byte

2175

2175/2111 and add a note to explain

Change Parameter page table Byte 105-106 and 108-109,and

change CRC Value

Merge chapters 2.1 and 21.1

Change the description of protection with WP# Pin

2018-2-13

2.0

Add Temperature Range F:Industrial+ (-40

℃ to 85℃)

2018-3-12

2.1

Modify the Value of Applied Input/ Output Voltage and VCC in

Chapter16

Modify the description of LGA8 6*8mm package

Update Ordering Information

2018-7-25

2.2

Modify the file name

2018-10-22

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