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GD25D40CSIG Scheda tecnica(PDF) 39 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25D40CSIG Scheda tecnica(HTML) 39 Page - GigaDevice Semiconductor (Beijing) Inc. |
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39 / 43 page ![]() 3.3V Uniform Sector Standard and Dual Serial Flash GD25D40C/20C 39 10.4. Package USON8 (1.5*1.5mm) Dimensions Symbol A A1 A2 A3 b D E D1 E1 D2 E2 e L L1 K K1 K2 Unit mm Min 0.40 0.00 0.33 REF 0.127 REF 0.13 1.40 1.40 0.20 REF 0.05 REF 0.60 1.20 0.40 REF 0.15 0.06 REF 0.20 REF 0.10 REF 0.15 REF Nom 0.45 0.02 0.18 1.50 1.50 0.70 1.30 0.20 Max 0.50 0.05 0.25 1.60 1.60 0.80 1.40 0.25 Note: 1. Both the package length and width do not include the mold flash. 2. The exposed metal pad area on the bottom of the package is floating. 3. Coplanarity ≤0.08mm. Package edge tolerance≤0.10mm. 4. The lead shape may be of little difference according to different package factories. These lead shapes are compatible with each other. D E Top View D1 E2 L1 e Bottom View A1 Side View 1 4 8 5 K1 PIN 1# A3 A K E1 L b K2 D2 A2 |
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