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GD25LD40C Scheda tecnica(PDF) 41 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25LD40C Scheda tecnica(HTML) 41 Page - GigaDevice Semiconductor (Beijing) Inc. |
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41 / 46 page ![]() Uniform Sector Standard and Dual Serial Flash GD25LD40C/20C 41 10.6. Package USON8 (3x2mm, thickness 0.45mm) D E Top View L E1 D1 L1 b Bottom View e A1 Side View c A 1 4 8 5 PIN 1# Dimensions Symbol A A1 c b D D1 E E1 e L L1 Unit mm Min 0.40 0.00 0.10 0.20 2.90 0.15 1.90 1.55 0.50 0.30 0.10 Nom 0.45 0.02 0.15 0.25 3.00 0.20 2.00 1.60 0.35 Max 0.50 0.05 0.20 0.30 3.10 0.25 2.10 1.65 0.40 Note: 1. Both the package length and width do not include the mold flash. 2. The exposed metal pad area on the bottom of the package is floating. 3. Coplanarity ≤0.08mm. Package edge tolerance≤0.10mm. 4. The lead shape may be of little difference according to different package factories. These lead shapes are compatible with each other. |
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