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GD25LH40CMIG Scheda tecnica(PDF) 63 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25LH40CMIG Scheda tecnica(HTML) 63 Page - GigaDevice Semiconductor (Beijing) Inc. |
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63 / 69 page ![]() 1.8V Uniform Sector Dual and Quad Serial Flash GD25LH40C/20C/10C/05C 63 10.6 Package USON8 (3*2mm, 0.55mm thickness) D E Top View or Side View L E1 D1 L1 b Bottom View c A Note(4) Note(4) e 1 4 8 5 PIN 1# or Dimensions Symbol A A1 c b D D1 E E1 e L L1 Unit mm Min 0.50 0.00 0.10 0.20 2.90 0.15 1.90 1.55 0.50 0.30 0.10 Nom 0.55 0.02 0.15 0.25 3.00 0.20 2.00 1.60 0.35 Max 0.60 0.05 0.20 0.30 3.10 0.25 2.10 1.65 0.40 Note: 1. Both the package length and width do not include the mold flash. 2. The exposed metal pad area on the bottom of the package is floating. 3. Coplanarity ≤0.08mm. Package edge tolerance≤0.10mm. 4. The lead shape may be of little difference according to different package lead frames. These lead shapes are compatible with each other. |
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