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SSM3J56ACT Scheda tecnica(PDF) 3 Page - Toshiba Semiconductor

Il numero della parte SSM3J56ACT
Spiegazioni elettronici  MOSFETs Silicon P-Channel MOS
PDF  9 Pages
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Produttore elettronici  TOSHIBA [Toshiba Semiconductor]
Homepage  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

SSM3J56ACT Scheda tecnica(HTML) 3 Page - Toshiba Semiconductor

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SSM3J56ACT
3
5.
5.
5.
5. Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
5.1.
5.1.
5.1.
5.1. Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25 
))))
Characteristics
Gate leakage current
Drain cut-off current
Drain-source breakdown voltage
Drain-source breakdown voltage
Gate threshold voltage
Drain-source on-resistance
Forward transfer admittance
(Note 1)
(Note 2)
(Note 3)
(Note 3)
Symbol
IGSS
IDSS
V(BR)DSS
V(BR)DSX
Vth
RDS(ON)
|Yfs|
Test Condition
VGS = ±8 V, VDS = 0 V
VDS = -20 V, VGS = 0 V
ID = -1 mA, VGS = 0 V
ID = -1 mA, VGS = 5 V
VDS = -3 V, ID = -1 mA
ID = -800 mA, VGS = -4.5 V
ID = -500 mA, VGS = -2.5 V
ID = -200 mA, VGS = -1.8 V
ID = -100 mA, VGS = -1.5 V
ID = -10 mA, VGS = -1.2 V
VDS = -3 V, ID = -100 mA
Min
-20
-15
-0.3
0.5
Typ.
310
380
470
560
770
1.0
Max
±1
-1
-1.0
390
480
660
900
4000
Unit
µA
µA
V
V
V
mΩ
S
Note 1: If a forward bias is applied between gate and source, this device enters V(BR)DSX mode. Note that the drain-
source breakdown voltage is lowered in this mode.
Note 2: Let Vth be the voltage applied between gate and source that causes the drain current (ID) to below (-1 mA for
this device). Then, for normal switching operation, VGS(ON) must be higher than Vth, and VGS(OFF) must be
lower than Vth. This relationship can be expressed as: VGS(OFF) < Vth < VGS(ON).
Take this into consideration when using the device.
Note 3: Pulse measurement.
5.2.
5.2.
5.2.
5.2. Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25 
))))
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time (turn-on time)
Switching time (turn-off time)
Symbol
Ciss
Crss
Coss
ton
toff
Test Condition
VDS = -10 V, VGS = 0 V,
f = 1 MHz
VDD = -10 V, ID = -200 mA
VGS = 0 to -2.5 V, RG = 50 Ω
Duty ≤ 1 %, VIN: tr, tf < 5 ns,
Common source, See Chapter 5.3.
Min
Typ.
100
10
16
8
26
Max
Unit
pF
ns
5.3.
5.3.
5.3.
5.3. Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 5.3.1
5.3.1
5.3.1
5.3.1 Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 5.3.2
5.3.2
5.3.2
5.3.2 Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
2016-09-13
Rev.2.0
©2015 Toshiba Corporation



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