FFB2227A datasheet(2/6 Pages) ONSEMI

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Absolute Maximum Ratings(1)

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.

Notes:

1. These ratings are based on a maximum junction temperature of 150°C.

2. These are steady-state limits. ON Semiconductor should be consulted on applications involving pulsed or low-

duty cycle operations.

3. All voltages (V) and currents (A) are negative polarity for PNP transistors.

4. These Ratings are limiting values above which the serviceability of any semiconductor device may be impaired.

Thermal Characteristics(2)

Values are at TA = 25°C unless otherwise noted.

Note:

2. PCB board size: FR-4 76 x 114 x 0.6T mm3(3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.

Symbol

Parameter

Value

Units

VCEO

Collector-Emitter Voltage

VCBO

Collector-Base Voltage

VEBO

Emitter-Base Voltage

Collector Current - Continuous

500

TJ, TSTG

Operating and Storage Junction Temperature Range

- 55 to +150

°C

Symbol

Parameter

Maximum

Units

FFB2227A

FMB2227A

Total Device Dissipation

300

700

Derate Above 25

°C

2.4

5.6

mV/

°C

RθJA

Thermal Resistance, Junction to Ambient

415

180

°C/W

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