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AMC3301 Scheda tecnica(PDF) 5 Page - Texas Instruments |
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AMC3301 Scheda tecnica(HTML) 5 Page - Texas Instruments |
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5 / 23 page ![]() 5 AMC3301 www.ti.com SBAS917 – AUGUST 2019 Product Folder Links: AMC3301 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) AMC3301 UNIT DWL (SOIC) 16 PINS RqJA Junction-to-ambient thermal resistance 73.5 °C/W RqJC(top) Junction-to-case (top) thermal resistance 31 °C/W RqJB Junction-to-board thermal resistance 44 °C/W YJT Junction-to-top characterization parameter 16.7 °C/W YJB Junction-to-board characterization parameter 42.8 °C/W RqJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W 6.5 Power Ratings PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PD Maximum power dissipation VDD = 5.5 V 170.5 mW VDD = 3.6 V 108 |
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