6

General data

Operate time at U

Reset time (latching) at U

Release time without diode in parallel (non-latching), typ. / max.

Release time with diode in parallel (non-latching), typ. / max.

Bounce time at closing contact, typ. / max.

Maximum switching rate without load

Ambient temperature

Thermal resistance

Maximum permissible coil temperature

Vibration resistance (function)

Shock resistance, half sinus, 11 ms

half sinus, 0.5 ms

Degree of protection

Needle flame test

Mounting position

Processing information

Weight (mass)

Resistance to soldering heat

1 ms / 3 ms

1 ms /3 ms

1 ms / 3 ms

3 ms / 5 ms

1 ms / 5 ms

50 operations/s

-40° C ... +85° C

< 150 K/W

125° C

20 G

10 to 1000 Hz

50 G (function)

500 G (damage)

immersion cleanable, IP 67

application time 20 s, no burning and glowing

any

Ultrasonic cleaning is not recommended

max. 0.75 g

260° C / 10 s

IM Relay

All data refers to 23° C unless otherwise specified.

Recommended soldering conditions

Soldering conditions according CECC 00802

Vapor Phase Soldering: Temperature/Time Profile

(Lead Temperature)

Infrared Soldering: Temperature/Time Profile

(Lead Temperature)

Full line:

typical

Dotted line: process limits

10 sec

ca. 40 sec

max. 245° C

215° C

130° C

180° C

Time (s)

215° C

180° C

130° C

100° C

external preheating

20 - 40 sec

Full line:

typical

Dotted line: process limits

forced

cooling

Time (s)