XT
April 1999
4.5.99
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5.0
Electrical Specifications
Table 7: Absolute Maximum Ratings
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at
these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance,
functionality, and reliability.
PARAMETER
SYMBOL
MIN.
MAX.
UNITS
Supply Voltage, dc, Clock Buffers (VSS = ground)
VDD
VSS-0.5
7
V
Supply Voltage, dc, Serial Communications
VDD_I2C
VSS-0.5
7
V
Input Voltage, dc
VI
VSS-0.5
VDD+0.5
V
Output Voltage, dc
VO
VSS-0.5
VDD+0.5
V
Input Clamp Current, dc (VI < 0 or VI > VDD)IIK
-50
50
mA
Output Clamp Current, dc (VI < 0 or VI > VDD)IOK
-50
50
mA
Storage Temperature Range (non-condensing)
TS
-65
150
°C
Ambient Temperature Range, Under Bias
TA
-55
125
°C
Junction Temperature
TJ
125
°C
Lead Temperature (soldering, 10s)
260
°C
Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7)
2
kV
CAUTION: ELECTROSTATIC SENSITIVE DEVICE
Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy elec-
trostatic discharge.
Table 8: Operating Conditions
PARAMETER
SYMBOL
CONDITIONS/DESCRIPTION
MIN.
TYP.
MAX.
UNITS
Supply Voltage, Clock Buffers
VDD
3.3V ± 5%
3.135
3.3
3.465
V
Supply Voltage, Serial Communications
VDD_I2C
3.3V ± 5%
3.135
3.3
3.465
V
Ambient Operating Temperature Range
TA
070
°C
Input Frequency
fCLK
0
133
MHz
Output Load Capacitance
CL
30
pF
Serial Data Transfer Rate
Standard mode
10
100
400
kb/s
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