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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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HM5465AV Scheda tecnica(PDF) 12 Page - Shenzhen Huazhimei Semiconductor Co., Ltd |
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HM5465AV Scheda tecnica(HTML) 12 Page - Shenzhen Huazhimei Semiconductor Co., Ltd |
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12 / 12 page  ◼ SOLDERING METHODS FOR UNIVERCHIP Storage environment Temperature=10℃~35℃ Humidity=65%±15% Reflow soldering of surface mount device Profile Feature Sn-Pb Eutectic Assembly Pb free Assembly Average ramp-up rate (TL to TP) <3℃/sec <3℃/sec Preheat -Temperature Min (Tsmin) -Temperature Max (Tsmax) -Time (min to max) (ts) 100℃ 150℃ 60~120 sec 150℃ 200℃ 60~180 sec Tsmax to TL -Ramp-up Rate <3℃/sec <3℃/sec Time maintained above -Temperature (TL) -Time (tL) 183℃ 60~150 sec 217℃ 60~150 sec Peak Temperature (TP) 240℃+0/-5℃ 260℃+0/-5℃ Time within 5℃ of actual Peak Temperature (tP) 10~30 sec 20~40 sec Ramp-down Rate <6℃/sec <6℃/sec Time 25℃ to Peak Temperature <6 minutes <6 minutes HM5465A |
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