IRS2153D datasheet(2/12 Pages) IRF

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IRS2153D(S)PbF

Absolute Maximum Ratings

Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All

voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead.

The Thermal Resistance and Power Dissipation ratings are measured under board mounted and still air

conditions.

Parameter

Symbol

Definition

Min.

Max.

Units

High Side Floating Supply Voltage

-0.3

625

High Side Floating Supply Offset Voltage

VB - 25

VB + 0.3

High-Side Floating Output Voltage

VS – 0.3

VB + 0.3

Low-Side Output Voltage

-0.3

VCC + 0.3

IRT

RT Pin Current

-5

VRT

RT Pin Voltage

-0.3

VCC + 0.3

VCT

CT Pin Voltage

-0.3

VCC + 0.3

ICC

Supply Current (Note 1)

---

IOMAX

Maximum allowable current at LO and HO due to external

power transistor Miller effect.

-500

500

dVS/dt

Allowable Offset Voltage Slew Rate

-50

V/ns

Maximum Power Dissipation @ TA ≤ +25ºC, 8-Pin DIP

---

1.0

Maximum Power Dissipation @ TA ≤ +25ºC, 8-Pin SOIC

---

0.625

RθJA

Thermal Resistance, Junction to Ambient, 8-Pin DIP

---

ºC/W

RθJA

Thermal Resistance, Junction to Ambient, 8-Pin SOIC

---

128

ºC/W

Junction Temperature

-55

150

Storage Temperature

-55

150

ºC

Lead Temperature (Soldering, 10 seconds)

---

300

Note 1: This IC contains a zener clamp structure between the chip VCC and COM which has a nominal

breakdown voltage of 15.4V. Please note that this supply pin should not be driven by a DC, low

impedance power source greater than the VCLAMP specified in the Electrical Characteristics section.

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