TLV4021 datasheet(5/38 Pages) TI

5 / 38 page

TLV4021, TLV4031, TLV4041, TLV4051

www.ti.com

SNVSB04B – MARCH 2019 – REVISED JUNE 2020

Product Folder Links: TLV4021 TLV4031 TLV4041 TLV4051

Submit Documentation Feedback

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to (V–). Input signals that can swing more than 0.3 V below (V–) must be current-limited to 10 mA or

less.

In addition, IN can be greater than (V+) and OUT as long as it is within the –0.3 V to 6 V range. Input signals that can swing beyond this

range must be current-limited to 10 mA or less.

(3)

Short-circuit to ground.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

–0.3

Input voltage (IN) from (V–) (2)

–0.3

Input Current (IN)(2)

±10

Output voltage (OUT) from (V-)

TLV4021, TLV4031

–0.3

TLV4041, TLV4051

–0.3

(V+) + 0.3

Output short-circuit duration(3)

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

1.6

5.5

Ambient temperature, TA

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC (1)

TLV40x1

UNIT

YKA (DSBGA)

SOT-23 (DBV)

4 BUMPS

5 PINS

RθJA

Junction-to-ambient thermal resistance

205.5

181.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

1.8

101.1

°C/W

RθJB

Junction-to-board thermal resistance

75.3

52.0

°C/W

ψJT

Junction-to-top characterization parameter

0.9

28.2

°C/W

ψJB

Junction-to-board characterization parameter

74.7

51.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

TLV4021 Scheda tecnica(PDF) 5 Page - Texas Instruments

TLV4021 Scheda tecnica(HTML) 5 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38

Scheda tecnica Scarica

Link URL