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ASM3X2105AFS Scheda tecnica(PDF) 2 Page - Alliance Semiconductor Corporation

Il numero della parte ASM3X2105AFS
Spiegazioni elettronici  Low Frequency EMI Reduction
PDF  10 Pages
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Produttore elettronici  ALSC [Alliance Semiconductor Corporation]
Homepage  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

ASM3X2105AFS Scheda tecnica(HTML) 2 Page - Alliance Semiconductor Corporation

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October 2003
ASM3X2105A
rev 1.0
Low Frequency EMI Reduction
2 of 10
Notice: The information in this document is subject to change without notice.
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ASM3X2105A
XIN /CLK
XOUT
DIV2
VSS
SR0
SSON#
MODOUT
VDD
Pin Configuration
Pin Description
Pin#
Pin Name
Type
Description
1
XIN/CLK
I
Crystal connection or external reference frequency input. This pin has dual
functions. It can be connected to either an external crystal or an external
reference clock.
2
XOUT
O
Crystal connection. If using an external reference, this pin must be left
unconnected.
3
DIV2
I
Digital logic input used to select normal output mode or divide-by-2 output
mode. When this pin is HIGH, the frequency of the output clock is the same
as the input clock frequency. When it is tied LOW, the output frequency is
half the input clock frequency. This pin has an internal pull-up resistor.
4
VSS
P
Ground to entire chip.
5
SR0
I
Digital logic input used to select Spreading Range (Refer Spread Deviation
Table). This pin has an internal pull-up resistor.
6
SSON#
I
Digital logic input used to enable Spread Spectrum function (Active LOW).
Spread Spectrum function enabled when LOW, disabled when HIGH. This
pin has an internal pull-low resistor.
7
MODOUT
O
Spread spectrum low EMI output.
8
VDD
P
Power supply for the entire chip (5V).
Spread Deviation Table
SR0
Spread Deviation (%)
1
±1
0
Reserved



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