Data Sheet

ADL6012

Rev. 0 | Page 7 of 24

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

NOTES

1. EXPOSED PAD. THE EXPOSED PAD (EPAD) ON THE UNDERSIDE OF THE DEVICE

IS ALSO INTERNALLY CONNECTED TO GROUND AND REQUIRES GOOD THERMAL

AND ELECTRICAL CONNECTION TO THE GROUND OF THE PRINTED CIRCUIT BOARD (PCB).

CONNECT ALL GROUND PINS TO A LOW IMPEDANCE GROUND PLANE

TOGETHER WITH THE EPAD.

1

ENBL

2

RFCM

3

RFIN

4

RFCM

5

VPOS

10 DCPL

9

VENV+

8

VENV–

7

VOCM

6

OCOM

ADL6012

TOP VIEW

(Not to Scale)

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1

ENBL

Device Enable. Connect this pin to VPOS to enter an enabled state. Connect this pin to ground to enter a disabled

state. This pin can also be driven from a 3 V logic output.

2, 4

RFCM

RF Input Ground Pins. The RFCM pins are connected to the exposed pad (EPAD) at the bottom of the package.

Connect the RFCM pins to the system ground using a low impedance ground plane together with the EPAD.

3

RFIN

Signal Input. The RFIN pin is ac-coupled and has a nominal 100 Ω RF input impedance.

5

VPOS

Supply Voltage. The operational range of this pin is from 3.15 V to 5.25 V. Decouple the power supply using suggested

capacitor values of 100 pF and 0.1 µF and place these capacitors as close as possible to the VPOS pin.

6

OCOM

Output Common. Connect this pin to a low impedance ground plane together with the EPAD.

7

VOCM

Output Common-Mode Control Input. This pin is internally biased to VPOS/2, nominal. An acceptable range on

this pin is 0.9 V to VPOS/2.

8, 9

VENV−,

VENV+

Envelope Detector Pseudo Differential Outputs. VENV− and VENV+ are the negative and positive outputs, respectively,

for the envelope detector output. A 50 Ω output impedance per pin forms a 100 Ω differential output impedance.

These pins feature a 100 Ω differential load and a 2 pF to ground per pin drive capability.

10

DCPL

Bypass Pin for an Internal Bias Node. Connect this pin through a 0.1 µF capacitor to ground for best common-

mode noise rejection.

EPAD

Exposed Pad. The exposed pad (EPAD) on the underside of the device is also internally connected to ground and

requires good thermal and electrical connection to the ground of the printed circuit board (PCB). Connect all

ground pins to a low impedance ground plane together with the EPAD.