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DS3173N Scheda tecnica(PDF) 1 Page - Dallas Semiconductor |
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DS3173N Scheda tecnica(HTML) 1 Page - Dallas Semiconductor |
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1 / 232 page ![]() 1 of 230 REV: 102204 Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata. GENERAL DESCRIPTION The DS3171, DS3172, DS3173, and DS3174 (DS317x) combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper lines. APPLICATIONS Access Concentrators Multiservice Access Platform (MSAP) SONET/SDH ADM and Muxes PBXs Multiservice Protocol Platform (MSPP) Digital Cross Connect Test Equipment PDH Multiplexer/ Demultiplexer Routers and Switches Integrated Access Device (IAD) ORDERING INFORMATION PART TEMP RANGE PIN-PACKAGE DS3171* 0°C to +70°C 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) DS3171N* -40°C to +85°C 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) DS3172* 0°C to +70°C 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) DS3172N* -40°C to +85°C 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) DS3173* 0°C to +70°C 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) DS3173N* -40°C to +85°C 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) DS3174 0°C to +70°C 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) DS3174N -40°C to +85°C 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) *Future product—contact factory for availability. FUNCTIONAL DIAGRAM DS317x DS3/E3 PORTS DS3/ E3 LIU DS3/E3 FRAMER/ FORMATTER SYSTEM BACKPLANE FEATURES § Single (DS3171), Dual (DS3172), Triple (DS3173), or Quad (DS3174) Single-Chip Transceiver for DS3 and E3 § All Four Devices are Pin Compatible for Ease of Port Density Migration in the Same Printed Circuit Board Platform § Each Port Independently Configurable § Performs Receive Clock/Data Recovery and Transmit Waveshaping for DS3 and E3 § Jitter Attenuator can be Placed Either in the Receive or Transmit Paths § Interfaces to 75 W Coaxial Cable at Lengths Up to 380 meters, or 1246 feet (DS3) or 440 meters, or 1443 feet (E3) § Uses 1:2 Transformers on Both Tx and Rx § On-Chip DS3 (M23 or C-Bit) and E3 (G.751 or G.832) Framer(s) § Ports Independently Configurable for DS3, E3 § Built-In HDLC Controllers with 256-Byte FIFOs for the Insertion/Extraction of DS3 PMDL, G.751 Sn Bit, and G.832 NR/GC Bytes § On-Chip BERTs for PRBS and Repetitive Pattern Generation, Detection, and Analysis § Large Performance-Monitoring Counters for Accumulation Intervals of at Least 1 Second § Flexible Overhead Insertion/Extraction Ports for DS3, E3 Framers DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com |
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