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4833 Scheda tecnica(PDF) 3 Page - 3M Electronics |
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4833 Scheda tecnica(HTML) 3 Page - 3M Electronics |
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3 / 5 page ![]() Technical Data Sheet 3M™ Matrix-Resin 4833 Handling/Cure Information Note: This processing information is general or summary in nature and not intended to replace user’s careful consideration of the unique circumstances involved in its use of 3M products. To improve the ease of mixing with the curative, 3M™ Matrix Resin 4833 can be heated to 40°C before being combined with the curative. It is recommended to minimize the heat exposure of the resin in order to maximize the shelf life of the product. When 3M™ Matrix Resin 4833 is used in filament winding applications with curatives (i.e. DICY), it will normally require approximately 10°C higher heating of the resin coating bath to achieve an equal viscosity to a typical epoxy system and to achieve good fiber wet‑out. The use of 3M™ Matrix Resins does not require any changes to the curing conditions recommended for typical curatives – follow cure cycle as recommended by curative supplier. In some cases, the cure cycle can be shortened due to the significant reductions of exotherm and shrinkage experienced with 3M™ Matrix Resins. This is an especially important consideration in thick composite parts. 3M™ Matrix Resin 4833 may have undesirable interactions with surface‑active additives such as mold releases, air releasers, de‑foamers, pigments, fillers, tougheners, and additives. These undesirable interactions can adversely affect the performance of the 3M™ Matrix Resin, even at low concentrations. It is recommended initially to evaluate only the 3M™ Matrix Resin and curative components, eliminating all fillers and additives. Information on curatives suitable for use with 3M™ Matrix Resin 4833 is available by calling 3M Customer Service at 1‑800‑235‑2376. |
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