INA191 datasheet(6/41 Pages) TI

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6.4 Thermal Information

THERMAL METRIC(1)

INA191

INA2191

UNIT

YFD (DSBGA)

YBJ (DSBGA)

6 PINS

12 PINS

RθJA

Junction-to-ambient thermal resistance

141.4

94.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

1.1

0.6

°C/W

RθJB

Junction-to-board thermal resistance

45.7

23.8

°C/W

ΨJT

Junction-to-top characterization parameter

0.4

0.3

°C/W

ΨJB

Junction-to-board characterization parameter

45.3

23.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Electrical Characteristics

at TA = 25°C, VSENSE = VIN+ – VIN–, VS = 1.8 V to 5.0 V, VIN+ = 12 V, VREF = VS / 2 (INA2191), and VENABLE = VS (unless

otherwise noted)

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

INPUT

CMRR

Common-mode

rejection ratio

VIN+ = –0.1 V to 40 V, TA = –40°C to +125°C

132

150

VOS

Offset voltage,

RTI(1)

VS = 1.8 V

–2.5

±12

µV

dVOS/dT Offset drift, RTI

TA = –40°C to +125°C

130 nV/°C

PSRR

Power-supply

rejection ratio, RTI

VS = 1.7 V to 5.5 V, single channel enabled for INA2191

–1

±5

µV/V

IIB

Input bias current

VSENSE = 0 mV

0.1

IIO

Input offset current

VSENSE = 0 mV

±0.07

OUTPUT

Gain

A1 devices

V/V

A2 devices

A3 devices

100

A4 devices

200

A5 devices

500

Gain error

VOUT = 0.1 V to VS – 0.1 V

A1 devices

–0.17%

±0.35%

A2, A3, A4,

A5 devices

–0.04%

±0.25%

Gain error drift

TA = –40°C to +125°C

7 ppm/°C

Nonlinearity error

VOUT = 0.1 V to VS – 0.1 V

±0.01%

RVRR

Reference voltage

rejection ratio

INA2191 only,

VREF = 100 mV to VS – 100 mV,

TA = –40°C to +125°C

A1 devices

±2

±12

µV/V

A2 devices

±1

±6

A3 devices

±0.5

±4

A4, A5

devices

±0.25

±3

Maximum

capacitive load

No sustained oscillation

VOLTAGE OUTPUT

VSP

Swing to VS power-

supply rail

VS = 1.8 V, RL = 10 kΩ to GND, TA = –40°C to +125°C

(VS) – 23

(VS) – 40

INA191, INA2191

SLYS020B – FEBRUARY 2019 – REVISED FEBRUARY 2021

www.ti.com

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