MX55/57

DS20005972A-page 16

 2018 Microchip Technology Inc.

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

2.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-1068A Sheet 2 of 2

6-Lead Low Profile Land Grid Array (ANA) - 5.0x3.2 mm Body [LLGA]

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Terminal Pitch

Mold Cap Height

Pitch

Substrate Thickness

Units

Dimension Limits

A1

A

b

E1

A2

e

L

E

N

1.27 BSC

1.10

0.85

0.85

1.26

0.19

0.90

0.90

2.10 BSC

1.33

0.23

3.20 BSC

MILLIMETERS

MIN

NOM

6

0.95

0.95

1.40

0.27

MAX

L1

0.10

0.15

Terminal Pullback

Overall Length

D

5.00 BSC

0.05

1.07

1.13