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Plastic package has Underwriters Laboratory Flammability

Classification 94V-0

Glass passivated chip junctions

High surge overload rating: 40A peak

Saves space on printed circuit boards

Case: Molded plastic body over passivated junctions

Terminals: Plated leads solderable per MIL-STD-750,

Method 2026

Mounting Position: Any

Weight: 0.078 oz., 0.22 g

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Package outline dimensions in inches (millimeters)

SEMICONDUCTOR

TECHNICAL DATA

MF2S ~ MF10S

2011 09 22

1/2

Revision No : 0

0

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1

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.

0

4

Notes

1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1 3 x 1.3mm) pads

2. On aluminum substrate P.C.B. with an area of 0.8 x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1 3 x 1.3mm) solder pad

3. Measured at 1.0 MHz and applied reverse voltage of 4 0 Volts