5 Package Outline and Mechanical Data

STw4141

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5

Package Outline and Mechanical Data

Note: 1 Max mounted height is 1.12 mm. Based on a 0.28 mm ball pad diameter.

Solder paste is 0.15 mm thickness and 0.28 mm diameter.

2 TFBGA stands for Thin Profile Fine Pitch Ball Grid Array.

Thin profile: The total profile height (DIm A) is measured from the seating plane to the top of the

component.

A = 1.01 to 1.20 mm

Fine pitch < 1.00 mm pitch.

3 The tolerance of position that controls the location of the pattern of balls with respect to datums

A and B.

For each ball there is a cylindral tolerance zone eee perpendicular to datum C and located on

true position with respect to datums A and B as defined by e. The axis perpendicular to datum

C of each ball must lie within this tolerance zone.

4 The tolerance of position that controls the location of the balls within the matrix with respect to

each other. For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and

located on true position as defined by e. The axis perpendicular to datum C of each ball must

lie within the tolerance zone.

Each tolerance zone fff in the array is contained entirely in the respective above eee zone

above.

The axis of each ball must be simultaneously in both tolerance zones.

5 Leadfree package according to JEDEC JESD-020-C

Table 11: TFBGA 3x3x1.20 16 F4x4 0.50. Package code: L0 - JEDEC/EAIJ reference

number: N/A

Ref

Min.

Typ.

Max.

A

1.01

1.20 (

Note 1)

A1

0.15

A2

0.82

b

0.25

0.30

0.35

D

2.85

3.00

3.15

D1

1.50

E

2.85

3.00

3.15

E1

1.50

e0.50

ddd

0.85

0.08

eee

0.15

fff

0.05