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STW41411 Scheda tecnica(PDF) 23 Page - STMicroelectronics |
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STW41411 Scheda tecnica(HTML) 23 Page - STMicroelectronics |
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23 / 27 page ![]() STw4141 4 Application information 23/27 4.7.2 TFBGA16 internal bumps access Pad centers are at 500 µm distance. Pad diameter is 275 µm. The distance between two adjacent pad edges is only 225 µm. We recommend a distance for lead-out signals from the center of pad matrix by 75 µm wide trace. Isolation distance in this case is 75 µm (see Figure 18 and Figure 19). Figure 18. TFBGA16 ball pad spacing and track parameters to internal pads Figure 19. PCB routing example using TFBGA16 Grid dot distance : with A = 500 µm B = 275 µm C = 75 µm |
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