EMI804x Series

www.onsemi.com

2

PIN FUNCTION DESCRIPTION

Pin Name

Device Pin

Type

Description

EMI8041

EMI8042

EMI8043

In_1+

1

1

1

I/O

CMF Channel 1+ to Connector (External)

In_1−

2

2

2

I/O

CMF Channel 1− to Connector (External)

Out_1+

6

10

16

I/O

CMF Channel 1+ to ASIC (Internal)

Out_1−

5

9

15

I/O

CMF Channel 1− to ASIC (Internal)

In_2+

NA

4

4

I/O

CMF Channel 2+ to Connector (External)

In_2−

NA

5

5

I/O

CMF Channel 2− to Connector (External)

Out_2+

NA

7

13

I/O

CMF Channel 2+ to ASIC (Internal)

Out_2−

NA

6

12

I/O

CMF Channel 2− to ASIC (Internal)

In_3+

NA

NA

7

I/O

CMF Channel 3+ to Connector (External)

In_3−

NA

NA

8

I/O

CMF Channel 3− to Connector (External)

Out_3+

NA

NA

10

I/O

CMF Channel 3+ to ASIC (Internal)

Out_3−

NA

NA

9

I/O

CMF Channel 3− to ASIC (Internal)

3,4

3, 8

3,6,14,11

GND

Ground

Parameter

Symbol

Value

Unit

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Maximum Lead Temperature for Soldering Purposes

(1/8” from Case for 10 seconds)

260

°C

DC Current per Line

100

mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.