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ADPA7008CHIP Scheda tecnica(PDF) 26 Page - Analog Devices |
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ADPA7008CHIP Scheda tecnica(HTML) 26 Page - Analog Devices |
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26 / 26 page ![]() ADPA7008CHIP Data Sheet Rev. 0 | Page 26 of 26 OUTLINE DIMENSIONS 3.610 SQ *This die utilizes fragile air bridges. Any pickup tools used must not contact this area. TOP VIEW (CIRCUIT SIDE) SIDE VIEW 1.194 0.888 0.08 0.126 0.126 0.642 0.787 0.770 0.624 0.888 1.068 3.270 0.260 *AIR BRIDGE AREA 0.102 0.130 0.174 0.197 0.197 1.532 3.355 0.668 0.938 1.595 1.598 0.110 0.110 0.101 (Pads 2 - 4) 0.125 0.095 × 0.145 (Pads 1 and 6) 0.145 × 0.095 (Pads 4 and 8) 0.095 × 0.095 (Pads 2, 3, 5, 7, 9, 10) 0.101 (Pads 8 - 10) 0.117 (Pads 5 - 7) Figure 68. 10-Pad Bare Die [CHIP] (C-10-12) Dimensions shown in millimeters ORDERING GUIDE Model1, 2 Temperature Range Package Description Package Option ADPA7008CHIP −55°C to +85°C 10-Pad Bare Die [CHIP] C-10-12 ADPA7008C-KIT −55°C to +85°C 10-Pad Bare Die [CHIP] C-10-12 1 The ADPA7008CHIP and ADPA7008C-KIT are RoHS compliant parts. 2 Die inspected to meet MIL-STD-883 Method 2010, Condition B. ©2021 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D25395-3/21(0) |
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