ISO6721 datasheet(9/46 Pages) TI

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6.7 Safety-Related Certifications

VDE

CSA

CQC

TUV

Plan to certify according to

DIN VDE V 0884-11:2017-

Plan to certify according to

IEC 62368-1, IEC 61010-1

and IEC 60601

Certified according to

UL 1577 Component

Recognition Program

Plan to certify according to

GB4943.1-2011

Plan to certify

according to EN

61010-1:2010/A1:2019,

EN 60950-1:2006/A2:2013

and EN 62368-1:2014

Maximum transient

isolation voltage, 4242

VPK;

Maximum repetitive peak

isolation voltage, 637 VPK;

Maximum surge isolation

voltage,

5000 VPK

400 VRMS basic insulation

per CSA 62368-1:19

and IEC 62368-1:2018,

(pollution degree 2,

material group III)

Single protection,

3000 VRMS

Basic insulation, Altitude ≤

5000 m, Tropical Climate,

250 VRMS maximum

working voltage

3000 VRMS (D-8) basic

insulation per EN

61010-1:2010/A1:2019 up

to working voltage of 300

VRMS (D-8)

3000 VRMS (D-8)

basic insulation per

EN 60950-1:2006/A2:2013

and EN 62368-1:2014 up

to working voltage of 400

VRMS (D-8)

Certificate planned

Master contract number:

220991

File number: E181974

Certificate planned

6.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

D-8 PACKAGE

Safety input, output, or supply current (1)

RθJA =104.6°C/W, VI = 5.5 V, TJ = 150°C,

TA = 25°C

See Figure 6-1

217.2

RθJA = 104.6°C/W, VI = 3.6 V, TJ = 150°C,

TA = 25°C

See Figure 6-1

332

RθJA = 104.6°C/W, VI = 2.75 V, TJ =

150°C, TA = 25°C

See Figure 6-1

434.5

RθJA = 104.6°C/W, VI = 1.89 V, TJ =

150°C, TA = 25°C

See Figure 6-1

628.9

Safety input, output, or total power (1)

RθJA = 104.6°C/W, TJ = 150°C, TA = 25°C

See Figure 6-2

1195

Maximum safety temperature (1)

150

°C

(1)

The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The

IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be

exceeded. These limits vary with the ambient temperature, TA.

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount

packages. Use these equations to calculate the value for each parameter:

TJ = TA + RθJA × P, where P is the power dissipated in the device.

TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.

PS = IS × VI, where VI is the maximum input voltage.

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ISO6720, ISO6721

SLLSFJ0B – JANUARY 2020 – REVISED MARCH 2021

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