MSM150 datasheet(2/2 Pages) LEIDITECH

Il numero della parte	MSM150

Spiegazioni elettronici	Lead-free and compliant with the European Union RoHS Directive

PDF	2 Pages

Scroll/Zoom	100%

Produttore elettronici	LEIDITECH [Shanghai Leiditech Electronic Technology Co., Ltd]

Homepage	http://www.leiditech.com

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Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

Rev : 01.06.2014

2/2

www.leiditech.com

MSM150

Cooling

Soldering

Preheating

Time(s)

120

10 to 20

30 to 90

300

260

160

250

200

150

100

Solder Reflow Recommendations

Solder Pad Layouts

Part number

(mm)

MSM150

3.45

1.78

3.15

* Recommended reflow methods: IR, Vapor phase, hot air oven.

* Devices can be cleaned using standard industry methods and

solvents.

Notes:

If reflow temperatures exceed the recommended profile, devices

may not meet the performance requirements.

Devices are not designed to be wave soldered to the bottom side

of the board.

Package Information

Tape & Reel: 2000pcs per reel.

Effectivity: Reference documents shall be the issue in effect on the

date of invitation for bid.

Caution: Operation beyond the rated voltage or current may result in

rupture electrical arcing or flame.

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