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ADPA7009CHIP Scheda tecnica(PDF) 28 Page - Analog Devices |
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ADPA7009CHIP Scheda tecnica(HTML) 28 Page - Analog Devices |
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28 / 28 page ![]() ADPA7009CHIP Data Sheet Rev. 0 | Page 28 of 28 OUTLINE DIMENSIONS 2.750 1.845 *This die utilizes fragile air bridges. Any pickup tools used must not contact this area. TOP VIEW (CIRCUIT SIDE) SIDE VIEW 0.572 0.108 0.114 0.389 0.389 0.460 0.112 0.354 0.255 0.179 0.220 0.179 0.255 0.175 0.130 0.898 0.102 0.644 0.786 0.197 0.197 0.653 0.890 0.100 × 0.100 (Pads 2, 3, 5, 7, 9, 10) 0.240 0.130 0.119 0.118 0.093 0.012 0.898 0.100 × 0.200 (Pads 1 and 6) 0.150 × 0.100 (Pads 4 and 8) *AIR BRIDGE AREA 0.104 (Pads 2 - 5) 0.105 (Pads 7 - 10) 0.102 Figure 82. 10-Pad Bare Die [CHIP] (C-10-13) Dimensions shown in millimeter ORDERING GUIDE Model1, 2 Temperature Range Package Description Package Option ADPA7009CHIP −55°C to +85°C 10-Pad Bare Die [CHIP] C-10-13 ADPA7009C-KIT −55°C to +85°C 10-Pad Bare Die [CHIP] C-10-13 1 The ADPA7009CHIP and ADPA7009C-KIT are RoHS compliant parts. 2 Die inspected to meet MIL-STD-883 Method 2010, Condition B. ©2021 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D26020-3/21(0) |
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