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V35PWM153HM3/I Scheda tecnica(PDF) 4 Page - Vishay Siliconix |
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V35PWM153HM3/I Scheda tecnica(HTML) 4 Page - Vishay Siliconix |
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4 / 5 page ![]() V35PWM153 www.vishay.com Vishay General Semiconductor Revision: 29-Jan-2021 4 Document Number: 98168 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Fig. 7 - Typical Resistance Junction to Ambient vs. Copper Pad Areas PACKAGE OUTLINE DIMENSIONS in inches (millimeters) 10 100 1000 10000 0 10 20 30 40 50 60 70 80 0123456789 10 Axis Title Copper Pad Areas (cm2) S (cm2) Epoxy printed circuit board FR4 copper thickness = 70 µm (9.40) (8.60) 0.370 0.339 (6.72) (6.48) 0.265 0.255 (6.32) (6.08) 0.249 0.239 (0.70) (0.30) 0.028 0.012 (0.41) (0.25) 0.016 0.010 (1.40) (1.20) (0.20) (0.00) 0.008 0.000 (1.40) (1.00) 0.055 0.039 (5.70) (5.30) 0.224 0.209 MIN. 0.240 (6.10) MIN. 0.235 (5.97) REF. 0.386 (9.80) MIN. 0.075 (1.90) MIN. 0.055 (1.40) NOM. 0.090 (2.29) 0.055 0.047 0.090 (2.29) NOM. 0.180 (4.57) NOM. (0.90) (0.70) 0.035 0.028 NOM. 0.205 (5.20) Mounting Pad Layout SlimDPAK (TO-252AE) |
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