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HFM104F Scheda tecnica(PDF) 6 Page - Rectron Semiconductor |
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HFM104F Scheda tecnica(HTML) 6 Page - Rectron Semiconductor |
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6 / 8 page ![]() REEL TAPING SPECIFICATIONS FOR SURFACE MOUNT DEVICES-FLAT MELF D W1 D2 D1 ( SMAF ) Fig.: Configuration of FLAT MELF TAPING (SMAF) ITEM SYMBOL SMAF mm(inch) Carrier width Carrier length Carrier depth Sprocket hole Reel outside diameter Reel inner diameter Feed hole diameter Strocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Totall tape thickness Tape width Reel width A B C D D1 D2 E F P P0 P1 T W W1 2.9 0.10 (0.114 0.004) 5.35 0.10 (0.211 0.004) 1.15 0.10 (0.045 0.004) 1.55 0.05 (0.061 0.002) 178 2.0 (7.0 0.079) 50 Min. 13 0.5 (0.512 0.020) 1.75 0.1 (0.069 0.004) 5.50 0.05 (0.217 0.002) 4.0 0.1 (0.157 0.004) 4.0 0.1 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.23 0.02 (0.009 0.001) 12.0 (0.472 ) 16.8 2.0 (0.661 0.079) Note: 1.Devices are packed in accordance with EIA standard RS-481-D and specification given above. 2.Available on 7 inch ( 1500 ct. ) or 13 inch ( 5000 ct. ) diameter reels. 0.3 0.1 0.012 0.004 D0 |
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