MCP4716 datasheet(3/70 Pages) MICROCHIP

3 / 70 page

 2012 Microchip Technology Inc.

DS25154A-page 3

MCP47A1

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

Voltage on VDD with respect to VSS .......................................................................................................... 0.6V to +7.0V

Voltage on SCL, and SDA with respect to VSS ..................................................................................................... -0.6V to VDD + 0.3V

Voltage on all other pins (VOUT and VREF) with respect to VSS ..................................................................... -0.3V to VDD + 0.3V

Input clamp current, IIK (VI < 0, VI > VDD) ............................................................................................................ ±20 mA

Output clamp current, IOK (VO < 0 or VO > VDD).................................................................................................. ±20 mA

Maximum output current sunk by any Output pin .................................................................................................. 25 mA

Maximum output current sourced by any Output pin ............................................................................................ 25 mA

Maximum current out of VSS pin .......................................................................................................................... 100 mA

Maximum current into VDD pin ............................................................................................................................. 100 mA

Maximum current into VREF pin............................................................................................................................. 250 uA

Maximum current sourced by VOUT pin ................................................................................................................. 40 mA

Maximum current sunk by VREF pin ....................................................................................................................... 40 mA

Package power dissipation (TA = +50°C, TJ = +150°C)

SC70-6 ..................................................................................................................................................... 480 mW

Storage temperature .............................................................................................................................. -65°C to +150°C

Ambient temperature with power applied .............................................................................................. -40°C to +125°C

ESD protection on all pins ..........................................................................................................................

6 kV (HBM)

.....................................................................................................................................................................

400V (MM)

 1.5 kV (CDM)

Latchup (JEDEC JESD78A) at +125°C ............................................................................................................. ±100 mA

Soldering temperature of leads (10 seconds) ...................................................................................................... +300°C

Maximum Junction Temperature (TJ) .................................................................................................................. +150°C

† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at those or any other conditions above those indicated in the

operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may

affect device reliability.

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