RCMC

www.vishay.com

Vishay MCB

Revision: 16-Mar-2020

3

Document Number: 32510

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DISSIPATION

Temperature Rise as a Function of the Power Applied

Overall Thermal Resistance 0.18 °C/W (See Assembly)

Permanent Applicate Power as a Function

of Heatsink Temperature

ASSEMBLY

Screws and bolts are supplied with each product.

Max. tightening torque:



200 Ncm, mechanical mounting



200 Ncm, electrical connection

2 screws TH M4 x 6/6 and 2 M4 contact lock washers for connections. 2 off CHC M4 x 16/16 class 8.

COOLING

The temperature of the heatsink may be maintained at the specified values with

• Forced air ventilation

• Internal circulation of a liquid cooling

• Heatsink contact surface: Ra 6.3 μm

• Evenness defect: 0.05 mm max.

• Surface temperature gradient (isotherm): 20 °C max.

• Thermal compound not supplied (resistance < 0.025 °C/W / 0.05 mm)

The user must select the thermal resistance of the heatsink according to the power applied

10

100

1000

10000

0

30

60

90

120

150

180

0

250

500

750

1000

Axis Title

P (W)

Δθ = f (P)

10

100

1000

10000

0

100

200

300

400

500

600

700

800

0

255075

100

125

150

175

Axis Title

θ (°C)

P = f (

θ)

P

n

57

±

0.2

M4 min. depth 5

Thermal compound