MPC755EC datasheet(34/56 Pages) NXP

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MPC755 RISC Microprocessor Hardware Specifications, Rev. 8

Freescale Semiconductor

Package Description

7.3

Package Parameters for the MPC755 CBGA

The package parameters are as provided in the following list. The package type is 25

× 25 mm, 360-lead

ceramic ball grid array (CBGA).

Package outline

× 25 mm

Interconnects

360 (19

× 19 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.65 mm

Maximum module height

3.20 mm

Ball diameter

0.89 mm (35 mil)

7.4

Mechanical Dimensions for the MPC755 CBGA

Figure 19 provides the mechanical dimensions and bottom surface nomenclature for the MPC755,

360 CBGA package.

Figure 19. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC755,

360 CBGA Package

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER

IS DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

360X

123456789 10 111213141516

0.3

0.15

0.2 C

171819

Millimeters

DIM

Min

Max

2.65

3.20

0.79

0.99

1.10

1.30

—0.60

0.82

0.93

25.00 BSC

6.75

25.00 BSC

7.87

1.27 BSC

0.2

A1 CORNER

0.2

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