HMC1048ALC3B

Data Sheet

Rev. B | Page 4 of 15

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

RF Input Power when LO = 18 dBm

16 dBm

LO Input Power

20 dBm

IF Input Power when LO = 18 dBm

16 dBm

IF Port Maximum Sink and Source Current

6 mA

Maximum Junction Temperature

175°C

235 mW

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature Range

−65°C to +150°C

Reflow Temperature

260°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

Class 1B (750 V)

Field Induced Charge Device Model

(FICDM)

Class C3 (1.25 kV)

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

resistance measured in a one-cubic foot sealed enclosure, and

Table 4. Thermal Resistance

Package Type

Unit

120

383

°C/W

1

See JEDEC standard JESD51-2 for additional information on optimizing the

thermal impedance.

SOLDER PROFILE

The typical Pb-free reflow solder profile shown in Figure 2 is

based on JEDEC J-STD-20C.

60 SECONDS

TO 180 SECONDS

20 SECONDS

TO 40 SECONDS

480 SECONDS MAX

TIME (Seconds)

260°C –5°C/+0°C

150°C TO 200°C

RAMP DOWN

6°C/SECONDS MAX

217°C

RAMP UP

3°C/SEC MAX

60 SECONDS

TO

150 SECONDS

Figure 2. Pb-Free Reflow Solder Profile

ESD CAUTION