TGL2201

Wideband Dual Stage VPIN Limiter

Data Sheet Rev. C

– January, 2021

- 4 of 6 -

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Mechanical Drawing and Bond Pad Description

Unit: millimeters

Thickness: 0.10

Die x, y size tolerance: ± 0.050

Chip edge to bond pad dimensions are shown to center of pad

Ground is backside of die

Unit: millimeters

Thickness: 0.10

Die x, y size tolerance: ± 0.050

Chip edge to bond pad dimensions are shown to center of pad

Ground is backside of die

Pad No. Symbol

Description

Pad Size (mm x mm)

1

RF Input

RF Input, 50 Ω, DC Blocked

0.096 x 0.250

2

RF Output

RF Output, 50 Ω, DC Blocked.

0.096 x 0.250

Assembly Drawing

Note: RF Input and RF Output ports are not interchangeable.

RF In

RF Out