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PCF8553 Scheda tecnica(PDF) 42 Page - NXP Semiconductors |
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PCF8553 Scheda tecnica(HTML) 42 Page - NXP Semiconductors |
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42 / 51 page ![]() NXP Semiconductors PCF8553 40 × 4 LCD segment driver Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 29. 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature MSL: Moisture Sensitivity Level Figure 29. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCF8553 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 4 — 20 April 2021 42 / 51 |
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