ADP5091ACPZ-1-R7 datasheet(28/28 Pages) AD

28 / 28 page

ADP5091/ADP5092

Data Sheet

Rev. A | Page 28 of 28

OUTLINE DIMENSIONS

0.80

0.75

0.70

0.50

BSC

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-8

BOTTOM VIEW

TOP VIEW

4.10

4.00 SQ

3.90

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

PIN 1

INDICATOR

0.30

0.25

0.20

0.20 MIN

2.44

2.30 SQ

2.16

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 49. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-24-14)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADP5091ACPZ-1-R7

−40°C to + 125°C

24-Lead Lead Frame Chip Scale Package [LFCSP], 200 mA Input

Peak Current

CP-24-14

ADP5091ACPZ-2-R7

−40°C to + 125°C

24-Lead Lead Frame Chip Scale Package [LFCSP], 300 mA Input

Peak Current

CP-24-14

ADP5092ACPZ-1-R7

−40°C to + 125°C

24-Lead Lead Frame Chip Scale Package [LFCSP], 200 mA Input

Peak Current

CP-24-14

ADP5091-1-EVALZ

Evaluation Board

ADP5091-2-EVALZ

Evaluation Board with Solar Harvester and Super Capacitor

ADP5092-1-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D14145-0-5/17(A)

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