ADP5360ACBZ-2-R7 datasheet(60/60 Pages) AD

Il numero della parte	ADP5360ACBZ-2-R7

Spiegazioni elettronici	Advanced Battery Management PMIC with Ultra Low Power Buck and Buck Boost

PDF	60 Pages

Scroll/Zoom	100%

Produttore elettronici	AD [Analog Devices]

Homepage	http://www.analog.com

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60 / 60 page

ADP5360

Data Sheet

Rev. 0 | Page 60 of 60

OUTLINE DIMENSIONS

2.600

2.560

2.520

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

BALL A1

IDENTIFIER

0.560

0.500

0.440

0.330

0.300

0.270

SIDE VIEW

0.230

0.200

0.170

0.300

0.200

0.170

COPLANARITY

0.04

2.00

REF

0.40

BSC

SEATING

PLANE

Figure 63. 32-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADP5360ACBZ-1-R7

−40°C to +85°C

32-Ball Wafer Level Chip Scale Package [WLCSP]

CB-32-2

ADP5360ACBZ-2-R7

−40°C to +85°C

32-Ball Wafer Level Chip Scale Package [WLCSP]

CB-32-2

ADP5360CB-EVALZ

Evaluation Board Assembled with ADP5360ACBZ-1-R7

Z = RoHS Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

registered trademarks are the property of their respective owners.

D20499-0-11/19(0)

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