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MPC8347ECVRADDB Scheda tecnica(PDF) 54 Page - NXP Semiconductors

Il numero della parte MPC8347ECVRADDB
Spiegazioni elettronici  MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
PDF  99 Pages
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Produttore elettronici  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
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MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
54
Freescale Semiconductor
Package and Pin Listings
Figure 38 and Figure 39 represent the AC timings from Table 54. Note that although the specifications
generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge
is the active edge.
Figure 38 shows the SPI timings in slave mode (external clock).
Figure 38. SPI AC Timing in Slave Mode (External Clock) Diagram
Figure 39 shows the SPI timings in master mode (internal clock).
Figure 39. SPI AC Timing in Master Mode (Internal Clock) Diagram
18 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8347EA is available
in two packages—a tape ball grid array (TBGA) and a plastic ball grid array (PBGA). See Section 18.1,
“Package Parameters for the MPC8347EA TBGA,” Section 18.2, “Mechanical Dimensions for the
MPC8347EA TBGA,” Section 18.3, “Package Parameters for the MPC8347EA PBGA,” and
Section 18.4, “Mechanical Dimensions for the MPC8347EA PBGA.”
18.1
Package Parameters for the MPC8347EA TBGA
The package parameters are provided in the following list. The package type is 35 mm
× 35 mm, 672 tape
ball grid array (TBGA).
Package outline
35 mm
× 35 mm
Interconnects
672
SPICLK (Input)
tNEIXKH
tNEIVKH
tNEKHOX
Input Signals:
SPIMOSI
(See Note)
Output Signals:
SPIMISO
(See Note)
Note: The clock edge is selectable on SPI.
SPICLK (Output)
tNIIXKH
tNIKHOX
Input Signals:
SPIMISO
(See Note)
Output Signals:
SPIMOSI
(See Note)
Note: The clock edge is selectable on SPI.
tNIIVKH



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