ADP1607ACPZN-R7 datasheet(4/16 Pages) AD

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ADP1606/ADP1607

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, VOUT to GND

−0.3 V to +3.6 V

FB to GND

−0.3 V to +1.4 V

EN, SW, MODE to GND (When VIN ≥ VOUT) −0.3 V to VIN + 0.3 V

EN, SW, MODE to GND (When VIN < VOUT) −0.3 V to VOUT + 0.3 V

EPAD to GND

−0.3 V to + 0.3 V

Operating Ambient Temperature Range

−40°C to +85°C

Maximum Junction Temperature

90°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Absolute maximum ratings apply individually only, not in

combination.

THERMAL OPERATING RANGES

The ADP1606/ADP1607 can be damaged when the junction

temperature limits are exceeded. The maximum operating

junction temperature (TJ(MAX)) takes precedence over the

maximum operating ambient temperature (TA(MAX)).

Monitoring ambient temperature does not guarantee that the

junction temperature (TJ) is within the specified temperature

limits.

In applications with high power dissipation and poor printed

circuit board (PCB) thermal resistance, the maximum ambient

temperature may need to be derated. In applications with

moderate power dissipation and low PCB thermal resistance,

the maximum ambient temperature can exceed the maximum

limit as long as the junction temperature is within specification

limits.

The junction temperature (TJ) of the device is dependent on the

ambient temperature (TA), the power dissipation of the device

(PD), and the junction-to-ambient thermal resistance of the

package (θJA). Maximum junction temperature (TJ) is calculated

from the ambient temperature (TA) and power dissipation (PD)

using the following formula:

TJ = TA + (PD × θJA)

THERMAL RESISTANCE

Junction-to-ambient thermal resistance (θJA) of the package

is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages. The

junction-to-ambient thermal resistance is highly dependent

on the application and board layout. In applications where high

maximum power dissipation exists, attention to thermal board

design is required. The value of θJA may vary, depending on

PCB material, layout, and environmental conditions.

θJA and θJC (junction to case) are determined according to

JESD51-9 on a 4-layer PCB with natural convection cooling

and the exposed pad soldered to the board with thermal vias.

Table 3.

Package Type

Unit

6-Lead LFCSP

66.06

4.3

°C/W

For additional information on thermal resistance, refer to the

Thermal Characteristics of IC Assembly.

ESD CAUTION

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