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ML7055LP Scheda tecnica(PDF) 27 Page - OKI electronic componets |
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ML7055LP Scheda tecnica(HTML) 27 Page - OKI electronic componets |
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27 / 30 page ![]() FEDL7055-02 OKI Semiconductor ML7055 27/30 P-LFBGA84-0909-0.80 Package material Epoxy resin Ball material Sn/Pb Package weight (g) 0.20 TYP. 5 Rev. No./Last Revised 1/May 15, 2000 (Unit: mm) ML7055LP - 84pinBGA (P-LFBGA84-0909-0.80) Note: A lead-free package is available. Please contact Oki Sales Office/Distributors for more information. Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). |
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