OPA2191 datasheet(22/59 Pages) TI

22 / 59 page

8 Detailed Description

8.1 Overview

The OPAx191 family of e-trim operational amplifiers use a method of package-level trim for offset and offset

temperature drift implemented during the final steps of manufacturing after the plastic molding process. This

method minimizes the influence of inherent input transistor mismatch, as well as errors induced during package

molding. The trim communication occurs on the output pin of the standard pinout, and after the trim points

are set, further communication to the trim structure is permanently disabled. Section 8.2 shows the simplified

diagram of the OPAx191.

Unlike previous e-trim operational amplifiers, the OPAx191 uses a patented two-temperature trim architecture to

achieve a very low offset voltage and low voltage offset drift over the full specified temperature range. This level

of precision performance at wide supply voltages makes these amplifiers useful for high-impedance industrial

sensors, filters, and high-voltage data acquisition.

8.2 Functional Block Diagram

36-V

Differential

Front End

Slew

Boost

e-WULPŒ

Operational Amplifier

Package Level Trim

IN+

IN±

VOUT

OPAx191

NCH Input

Stage

PCH Input

Stage

Output

Stage

High

Capacitive Load

Compensation

OPA191, OPA2191, OPA4191

SBOS701D – DECEMBER 2015 – REVISED AUGUST 2021

www.ti.com

Submit Document Feedback

Product Folder Links: OPA191 OPA2191 OPA4191

OPA2191 Scheda tecnica(PDF) 22 Page - Texas Instruments