MIC2606 datasheet(4/20 Pages) MICROCHIP

4 / 20 page

MIC2605/6

DS20006620A-page 4



2021 Microchip Technology Inc. and its subsidiaries.

Schottky Leakage Current

IRD

—

0.1

μA

VR = 30V

Output Overvoltage

Protection

VOVP

15% over programmed VOUT

Overtemperature Threshold

Shutdown

—

150

—

°C

—

°C

Hysteresis

Note 1: Specification for packaged product only.

2: Connect VDD pin to VIN pin when VIN ≤ 7V.

3: ISD = IVIN.

4: Ensured by design.

ELECTRICAL CHARACTERISTICS (Note 1)

TA = 25°C, VIN = VEN = 12V, unless otherwise noted. Bold values indicate –40°C ≤ TJ ≤ +125°C.

Parameter

Symbol

Min.

Typ.

Max.

Units

Conditions

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Junction Temperature

Range

–40

—

+125

°C

—

Lead Temperature

—

+260

°C

Soldering 10 seconds

Ambient Storage Temperature

–65

—

+150

°C

—

Package Thermal Resistance

Junction Thermal Resistance, 8-pin

2mm x 2mm TDFN leadless package

θJA

—

°C/W —

θJC

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum rating. Sustained junction temperatures above that maximum can impact device reliability.

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