MIC69301/2/3

DS20006625A-page 6



2021 Microchip Technology Inc. and its subsidiaries

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Junction Temperature

Range

–40

—

+125

°C

Note 1

Storage Temperature Range

–65

—

+125

°C

—

Lead Temperature

—

—

+260

°C

—

Package Thermal Resistance

Thermal Resistance, S-PAK 5-Ld

—

2

—

°C/W —

Thermal Resistance, S-PAK 5-Ld

—

38

—

°C/W —

Thermal Resistance, TO-263 5-Ld

—

2

—

°C/W —

Thermal Resistance, ePad SOIC 8-Ld

—

41

—

°C/W —

Thermal Resistance, DFN 12-Ld

—

60

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.