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STM32469VG Scheda tecnica(PDF) 208 Page - STMicroelectronics |
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STM32469VG Scheda tecnica(HTML) 208 Page - STMicroelectronics |
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208 / 220 page ![]() Package information STM32F469xx 208/220 DS11189 Rev 7 Figure 94. UFBGA(176+25) - Recommended footprint 6.7 LQFP208 package information This LQFP is a 208-ball, 28 x 28 mm low-profile quad flat package. eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 120. UFBGA(176+25) - Recommended PCB design rules (0.65 mm pitch BGA) Dimension Recommended values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 119. UFBGA(176+25) - Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. BGA_WLCSP_FT_V1 Dsm Dpad |
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