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ARF476FL Scheda tecnica(PDF) 8 Page - Microchip Technology |
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ARF476FL Scheda tecnica(HTML) 8 Page - Microchip Technology |
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8 / 14 page ![]() 3. Package Specification This section shows the package specification of the ARF476FL device. 3.1 Package Outline Drawing The following figure illustrates the package outline of the ARF476FL device. Figure 3-1. T3C Package Outline Note: Hazardous Material Warning! The white ceramic portion of the device between leads and mounting flange is beryllium oxide. Beryllium oxide dust is highly toxic when inhaled. Care must be take during handling and mounting to avoid damage to this area. These devices must never be thrown away with general industrial or domestic waste. Note: These devices are sensitive to electrostatic discharge. Proper handling procedures should be followed. ARF476FL Package Specification © 2022 Microchip Technology Inc. and its subsidiaries Datasheet DS00004436A-page 8 |
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